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Copper-Molybdenum-Copper (Cu-Mo-Cu) Composite Overview
Copper-Molybdenum-Copper (Cu-Mo-Cu) Composite Overview

Molybdenum heat sinks are often used as substrates, base plates, or inserts in advanced thermal management systems, particularly where conventional copper or aluminum sinks cannot meet performance requirements.

Molybdenum sheet for semiconductor thin film technology
Molybdenum, a transition metal with a high melting point, excellent electrical conductivity, and thermal conductivity, is primarily used as a substrate material or functional coating in thin-film technology. Its superior physicochemical properties ensure high stability and durability of the films. Molybdenum sheets exhibit outstanding performance, especially under high-temperature, high-pressure, and corrosive environments. Furthermore, its excellent corrosion resistance also leads to wide application in thin-film preparation for electronic devices, optical components, and various sensors. These characteristics of molybdenum sheets not only improve the performance of thin-film products but also bring innovative possibilities to high-tech fields such as aerospace and nuclear energy.

Molybdenum foil is one of the molybdenum products. It is through the powder metallurgy of molybdenum plate, after mechanical processing of 0.2mm flat rolling molybdenum, that is, molybdenum foil, its minimum purity of 99.9%. The processing of molybdenum foil is mainly to obtain the corresponding mechanical properties. The main processing processes include bending, spinning, drawing, stamping, etc., so that it can be used under high temperature and low temperature conditions. It is roughly the same as the nature of the molybdenum plate. Xiamen China Tungsten Online Technology Co., Ltd. can produce molybdenum foils of different shapes and types according to the thickness, surface conditions and tolerances required by customers. Molybdenum foil is widely used in electronics, electrical components, tensile products, furnace insulation and corrosion-resistant products.

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