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Copper-Molybdenum-Copper (Cu-Mo-Cu) Composite Overview
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introduce
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Copper-Molybdenum-Copper (Cu-Mo-Cu) is a laminated composite material that consists of a molybdenum core sandwiched between two layers of copper. This structure combines the high thermal conductivity of copper with the low thermal expansion and high temperature resistance of molybdenum, making it an excellent choice for advanced thermal management in electronics.
Key Features:
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Controlled Thermal Expansion: Matches the coefficient of thermal expansion (CTE) of semiconductor materials (e.g., silicon, GaN), reducing thermal stress and improving reliability.
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Excellent Thermal Conductivity: Efficiently dissipates heat from high-power devices.
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High Mechanical Strength: Provides structural support while withstanding thermal cycling.
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Good Bonding Performance: Compatible with standard soldering and brazing techniques.
Typical Composition:
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Molybdenum core: 60–80% by thickness
(Exact ratios can be tailored to meet specific thermal and mechanical requirements.)
Applications:
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Base plates and heat spreaders for power semiconductor modules (e.g., IGBT, MOSFET)
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Microwave and RF devices
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LED packaging
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Aerospace and defense electronic systems
Benefits: Cu-Mo-Cu offers a cost-effective and high-performance alternative to traditional heat sink materials, especially where precise thermal expansion control and high thermal conductivity are both critical.
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Copper-Molybdenum-Copper (Cu-Mo-Cu) Composite Overview
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