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Molybdenum sheet for semiconductor thin film technology
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Preparation Techniques for Semiconductor Thin Films
1. Physical Vapor Deposition (PVD)
Physical vapor deposition is a technique that uses physical methods in a high-vacuum environment to transfermolybdenum platefrom the source to the substrate to form a thin film.
A. Vacuum Evaporation
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Principle: In a high-vacuum environment,molybdenum plateis heated to its evaporation point, causing its atoms or molecules to evaporate and condense on a cooled substrate, forming a continuous thin film.
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Equipment and Operation: Methods such as resistance heating, electron beam heating, or laser heating are used. Controlling the evaporation rate and substrate temperature is crucial.
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Applications: Primarily used for preparing metal, oxide, and some organic thin films.
B. Sputter Deposition
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Principle: High-energy ions bombard a solid target material, causingmolybdenum plateatoms or molecules to be excited or ionized and sputtered onto the substrate, forming a thin film.
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Equipment and Operation: Techniques such as DC sputtering, RF sputtering, and magnetron sputtering. In the sputtering process, the selection of the ion source, the distance between the target and the substrate, the type and purity of the target material, and the substrate temperature are key factors affecting the quality of the thin film.
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Applications: Widely used in the fields of insulating films, conductive films, and magnetic films.
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Molybdenum sheet for semiconductor thin film technology
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