Classify All
×
Thermal deposition material
Tungsten-molybdenum alloys are used as thermal deposition materials in the semiconductor field for thermal deposition sheets, thermal deposition substrates, thermal deposition sheet holders, and other heat dissipation components. Its high thermal conductivity, high strength and high temperature resistance enable it to effectively dissipate heat and improve the performance and reliability of semiconductor devices.
Address: China (Henan) Pilot Free Trade Zone Luoyang Area (High tech) Dongmagou Industrial Park No.1 Courtyard 1-9 Zone
E-mail:monfils.chen@mtwkj.com
Enterprise Station:http://www.mtwkj.com
Product Station:http://www.mtwxcl.com