The composition, structure, types, and applications of sputtering targets.

Release time:

2025-01-03


1. Composition

The composition of sputtering targets depends on application requirements and can be divided into the following categories:

  • Metal targets: Single metal elements, such as aluminum (Al), copper (Cu), titanium (Ti), gold (Au), silver (Ag), etc.
  • Alloy targets: Alloys composed of multiple metal elements, such as aluminum-silicon (Al-Si), aluminum-copper (Al-Cu).
  • Ceramic targets: Non-metallic compounds, such as oxides (Al₂O₃, ZnO), nitrides (TiN), carbides (SiC).
  • Compound targets: Such as sulfides (MoS₂), silicides (NiSi₂).
  • Composite targets: Composites of multiple materials, such as metal and oxide composite targets.

2. Structure

The internal microstructure and processing methods of sputtering targets have a significant impact on performance:

  • Density: High-density targets have higher sputtering efficiency and uniformity.
  • Grain size: The smaller the grain size, the higher the uniformity of the film.
  • Uniformity: The compositional uniformity of the target determines the uniformity of the deposited film.
  • Purity: High-purity targets reduce impurities in the film, enhancing the electrical and optical performance of the film.

3. Types

According to shape and usage characteristics, sputtering targets can be divided into:

  • Flat targets: Commonly found in planar sputtering equipment, usually rectangular or disc-shaped.
  • Rotating targets: Used for large-area coating and efficient production, typically cylindrical.
  • Special-shaped targets: Such as irregular targets, meeting specific application needs.

Classified by function:

  • Conductive targets: Such as aluminum and copper, mainly used for electronic components.
  • Transparent conductive targets: Such as ITO (indium tin oxide), used for touch screens and displays.
  • Hard coating targets: Such as TiN and CrN, used for tools and molds.
  • Magnetic targets: Such as CoFe and NiFe, used for magnetic storage devices.

4. Applications

Sputtering targets are widely used in the following fields:

Electronics and semiconductors

  • Integrated circuits: Aluminum and copper are used for wiring layers; titanium and tantalum are used for diffusion barrier layers.
  • Memory: Magnetic targets are used to manufacture magnetic storage films.
  • Displays: ITO targets are used for touch screens, OLEDs, and LCD displays.

Optics and optoelectronics

  • Optical films: Such as anti-reflective films and anti-reflective coatings, commonly using SiO₂, TiO₂, and other targets.
  • Solar cells: TCO (transparent conductive oxide) targets are used for thin-film solar cells.

Decoration and hard coatings

  • Hard tool coatings: Such as TiN and CrN, used to improve wear resistance and service life.
  • Decorative coatings: Such as metal targets used to produce brightly colored decorative films.

Energy and environment

  • Energy storage devices: Lithium battery electrode materials such as LiCoO₂ and LiMn₂O₄.
  • Gas sensors: Such as ZnO and SnO₂ film materials.

Medical and biological

  • Biocompatible coatings: Such as TiN and TiO₂, used for the surfaces of medical implants.

Future development directions

  1. High purity and high density: Core technologies to improve film performance.
  2. Composite material targets: To meet the needs of multifunctional films.
  3. Sustainable materials: Developing environmentally friendly and resource-saving targets.
  4. Large-scale and complexity: To adapt to the needs of large-area and complex-shaped coating equipment.